Micro-Transfer Printing (MTP) creates 3D ICs with previously-unattainable levels of performance by stacking ultra thin die, termed x-chips, onto a host wafer/substrate in an efficient, massively parallel operation. MTP enables heterogeneous integration of a wide variety of devices, including RF and power transistors, hardware assurance features, photonics, sensors, capacitors, inductors, filters and antennas made using different process nodes and technologies, including GaN, GaAs, InP, SiGe and SOI.
MTP provides a critical tool-in-the-toolbox that supplements other heterogeneous integration capabilities by uniquely integrating large numbers of separately manufactured x-chips, each made using the best materials and technologies for its function, to create 3D ICs that fit seamlessly into the existing packaging and test ecosystem.
MTP provides a critical tool-in-the-toolbox that supplements other heterogeneous integration capabilities by uniquely integrating large numbers of separately manufactured x-chips, each made using the best materials and technologies for its function, to create 3D ICs that fit seamlessly into the existing packaging and test ecosystem.
Services
About Us
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X-Celeprint develops and licenses patented Micro-Transfer Printing (TP) and related technologies.
TP is a cost-effective and scalable manufacturing platform for 3D Heterogeneous integration, enabling integration of microscale devices, such as FETs for power management, analog mixed-signal or RF microchips, capacitors, and other functionalities, using standard RDL interconnect.
In addition, devices such as TFT transistors, lsers, LEDs or integrated circuits can be transferred en masse onto non-native substrates.
TP is a cost-effective and scalable manufacturing platform for 3D Heterogeneous integration, enabling integration of microscale devices, such as FETs for power management, analog mixed-signal or RF microchips, capacitors, and other functionalities, using standard RDL interconnect.
In addition, devices such as TFT transistors, lsers, LEDs or integrated circuits can be transferred en masse onto non-native substrates.
Technology
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MTP technology enables heterogenous integration (HI), providing cost-effective production of 3D ICs that incorporate a wide range of passive and discrete components.
MTP is a high-yield, massively-parallel process, integrating one or more kinds of thin x-chips, interconnected using standard thin film metal processes.
MTP enables superior chip performance in the simple form factor of a monolithic IC wafer that is further processed by a wide range of advanced packaging techniques for monolithic dies.
MTP is a high-yield, massively-parallel process, integrating one or more kinds of thin x-chips, interconnected using standard thin film metal processes.
MTP enables superior chip performance in the simple form factor of a monolithic IC wafer that is further processed by a wide range of advanced packaging techniques for monolithic dies.
Applications
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Micro-Transfer Printing can be used to build Photonic Integrated Circuits (PICs) with very efficient usage of valuable source materials, such as lasers, modulators, and detectors.
Efficient assembly of multiple heterogeneous materials Lasers, Modulators, Detectors, Driver ICs: analog and logic.
Increase performance and power density Loosely packed x-chips on destination wafer improves thermal performance enabling larger HEMTs.
Micro-Transfer Printing can tightly integrate power transistors - UFETs and LFETs from a wide variety of materials - onto a silicon CMOS driver IC.
Efficient assembly of multiple heterogeneous materials Lasers, Modulators, Detectors, Driver ICs: analog and logic.
Increase performance and power density Loosely packed x-chips on destination wafer improves thermal performance enabling larger HEMTs.
Micro-Transfer Printing can tightly integrate power transistors - UFETs and LFETs from a wide variety of materials - onto a silicon CMOS driver IC.
Resources
Report
X-FAB Becomes First Foundry to Offer High-Volume Micro-Transfer Printing Capabilities Following Licensing Agreement with X-Celeprint.
ASM AMICRA Unveils Industry's First Manufacturing Systems Incorporating X-Celeprint's MTP Technology for High Volume Heterogeneous Integration of Ultra-Thin Chips.
A high concentration photovoltaic module utilizing micro-transfer printing and surface mount technology.
A new approach for a low cost CPV module design utilizing micro-transfer printing technology.
Edge-coupling of O-band InP etched-facet lasers to polymer waveguides on SOI by micro-transfer-printing.
ASM AMICRA Unveils Industry's First Manufacturing Systems Incorporating X-Celeprint's MTP Technology for High Volume Heterogeneous Integration of Ultra-Thin Chips.
A high concentration photovoltaic module utilizing micro-transfer printing and surface mount technology.
A new approach for a low cost CPV module design utilizing micro-transfer printing technology.
Edge-coupling of O-band InP etched-facet lasers to polymer waveguides on SOI by micro-transfer-printing.
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